We got the Samsung Galaxy S10 + a little early! Got the Exynos Samsung Galaxy S10 + SM-G975F / DS from Korea and has been in our labs since the beginning of this morning. We are excited to post some photos and early reviews of the new mobile phone from Galaxy. As usual, we will continue to update our page as we progress through Teardown, and subscribers can access all Teardown photos and any other device using RTU on the new application.
We will also examine the Qualcomm Galaxy S10 model for the North American market in the coming days. Until then we will focus on the Xenos model.
In addition to our analysis of the internal workings of the Galaxy S10 +, we also made a quick estimate of the unit cost. Here, we provide some cost points, along with an overview of cost allocation in the phone.
Samsung was able to save some money using the new Exynos 9820 at 8 nm on Exynos 9810 at 10 nm. Both sizes are almost identical (122 mm 2 in S9 + and 124 mm 2 in S10 +), but the S10 + processor costs about $ 10 less than the S9 + unit due to lower chip prices in the last 10 months.
The cost of the show increased by about $ 9 due to the larger size, drill hole and edge-to-edge design.
Memory pricing continues to decline exponentially, allowing Samsung to double the storage space from 64 GB to 128 GB in the base unit and add an extra 2 GB of LPDDR4X without increasing the incremental cost. Samsung has also included a 128GB microSD card in the S10 + box, which adds just under $ 12 to support costs.
Dynamic security is added to the sub-display system using the only Qualcomm part we have found in the Exynos Galaxy S10 + to date. This new ultrasonic sensor uses sound waves created using an electric piezo component. The entire solution is provided by Qualcomm and contains QBT2000 ASIC that is assembled into a flexible substrate. There are several advantages to using sound waves instead of the fingerprint sensor inside the screen as we first saw in the Vivo X21 UD.
he first is the Sonic 3D solution, which allows unlocking your phone even when there is debris or moisture on your finger, or if you need to unlock your phone while immersing it in water. This is because the sensor looks for density differences in the fingerprint instead of the visual image.
There are two other important points about the Qualcomm 3D audio sensor: the first, which could be more important from the manufacturing point of view, is the Qualcomm 3D Sonic solution, which allows regrouping in the manufacturing line if there is a problem with the main display subsystem or with the sensor set itself. This means that if the panel or sensor set is not repairable, at least some groups can be saved. This can reach cost savings in the event of a defect.
The second observation, Qualcomm has many different sizes for Sonic 3D sensor. In the Galaxy S10 +, the sensor is only 4mm × 9mm, however, Qualcomm indicates that larger sensors are on their way, including a 24 cm² sensor.
First Samsung Galaxy S10 + Purchased for the Korean Market As was the case with the Galaxy S, the Korean model is powered by Samsung’s Exynos application processor (AP). The new processor is Exynos 9820 and is supported by Samsung’s FinFET 8-nm LPP (Low Power Plus) technology. Exynos 9820 is one of two ICS phases in the Package-on-Package (PoP) package located on the 1st side of the motherboard.
The second IC of the PoP Society is Samsung Semiconductor 8 GB LPDDR4x DRAM K3UH7H70AM-AGCL. It is the second-generation Samsung LPDDR4X 10nm (1y). Are assembled here on top of the Samsung Exynos 9820 AP.
This is not the first time we see where the new memory chip is. We first discovered that it was recently assembled with the new Qualcomm Snapdragon 855 in Lenovo Z5 Pro GT
Galaxy S10 + or Samsung Galaxy S10 IC will not have the new UFS 3.0 memory – this honor will be found in the next Samsung Galaxy Fold.
For the Galaxy S10, we found the same Samsung KLUDG4U1EA-B0C1, the 128 GB UFS 2.1 flash memory we saw on Samsung Galaxy Note 9 and many other smart phones.
For More Information: Samsung S10 Price in Pakistan
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